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| BYV32-200 SWITCHMODEt Power Rectifier Features and Benefits * * * * * * Low Forward Voltage Low Power Loss/High Efficiency High Surge Capacity 175C Operating Junction Temperature 16 A Total (8 A Per Diode Leg) Pb-Free Packages are Available* http://onsemi.com ULTRAFAST RECTIFIER 16 AMPERES, 200 VOLTS trr = 35 ns 1 2, 4 3 Applications * Power Supply - Output Rectification * Power Management * Instrumentation Mechanical Characteristics * * * * * * Case: Epoxy, Molded Epoxy Meets UL 94 V-0 @ 0.125 in Weight: 1.9 Grams (Approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds ESD Rating: Human Body Model 3B Machine Model C MARKING DIAGRAM 4 TO-220AB CASE 221A PLASTIC 1 2 AYWW BYV32-200G AKA 3 A Y WW BYV32-200 G AKA = Assembly Location = Year = Work Week = Device Code = Pb-Free Package = Diode Polarity ORDERING INFORMATION Device BYV32-200 BYV32-200G Package TO-220 TO-220 (Pb-Free) Shipping 50 Units / Rail 50 Units / Rail *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (c) Semiconductor Components Industries, LLC, 2006 1 August, 2006 - Rev. 2 Publication Order Number: BYV32-200/D BYV32-200 MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current, TC = 156C Per Leg Total Device Peak Rectified Forward Current (Square Wave, 20 kHz), TC = 154C - Per Diode Leg Nonrepetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Operating Junction Temperature and Storage Temperature Symbol VRRM VRWM VR IF(AV) 8.0 16 IFM IFSM TJ, Tstg 16 100 -65 to +175 A A C Value 200 Unit V A Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Characteristic Maximum Thermal Resistance, Junction-to-Case Maximum Thermal Resistance, Junction-to-Ambient Conditions Min. Pad Min. Pad Symbol RqJC RqJA Value 3.0 60 Unit C/W ELECTRICAL CHARACTERISTICS Characteristic Instantaneous Forward Voltage (Note 1) (iF = 5.0 A, Tj = 100C) (iF = 20 A, Tj = 25C) Instantaneous Reverse Current (Note 1) (Rated dc Voltage, Tj = 100C) (Rated dc Voltage, Tj = 25C) Maximum Reverse Recovery Time (IF = 1.0 A, di/dt = 50 A/ms) (IF = 0.5 A, IR = 1.0 A, IREC = 0.25 A) 1. Pulse Test: Pulse Width = 300 s, Duty Cycle 2.0% Symbol vF - - iR - - trr - - - - 35 25 21 3.5 600 50 ns 0.74 1.01 0.85 1.15 mA Min Typical Max Unit V http://onsemi.com 2 BYV32-200 IF, INSTANTANEOUS FORWARD CURRENT (A) 100 70 50 100 175C 10 100C 25C 30 20 i F , INSTANTANEOUS FORWARD CURRENT (AMPS) TJ = 175C 10 7.0 25C 5.0 100C 1.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Figure 2. Maximum Forward Voltage 3.0 2.0 IR, REVERSE CURRENT (m A) 800 400 200 80 40 20 8.0 4.0 2.0 0.8 0.4 0.2 0.08 0.04 0.02 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 vF, INSTANTANEOUS VOLTAGE (VOLTS) 20 40 60 1.0 0.7 0.5 TJ = 175C 100C 25C 0.3 0.2 80 100 120 140 160 180 200 VR, REVERSE VOLTAGE (VOLTS) Figure 3. Typical Reverse Current, Per Leg* * The curves shown are typical for the highest voltage device in the voltage grouping. Typical reverse current for lower voltage selections can be estimated from these same curves if VR is sufficiently below rated VR. 20 IF(AV), AVERAGE FORWARD CURRENT (A) 18 16 14 12 10 8.0 6.0 4.0 2.0 0 0 SQUARE WAVE 25 50 75 100 125 150 175 SQUARE WAVE dc dc RqJA = 16C/W RqJA = 60C/W (NO HEATSINK) Figure 1. Typical Forward Voltage, Per Leg IF(AV), AVERAGE FORWARD CURRENT (A) 20 18 16 14 12 10 8.0 6.0 4.0 2.0 0 140 145 150 155 160 165 170 175 180 TC, CASE TEMPERATURE (C) dc SQUARE WAVE TA, AMBIENT TEMPERATURE (C) Figure 4. Current Derating, Case, Per Leg Figure 5. Current Derating, Ambient, Per Leg http://onsemi.com 3 BYV32-200 PF(AV), AVERAGE POWER DISSIPATION (WATTS) 24 22 20 18 16 14 12 10 8.0 6.0 4.0 2.0 0 0 2.0 4.0 6.0 8.0 10 12 14 16 18 20 IF(AV), AVERAGE FORWARD CURRENT (AMPS) TJ = 175C SQUARE WAVE dc Figure 6. Power Dissipation, Per Leg 1000 C, CAPACITANCE (pF) 300 TJ = 25C 100 30 10 1.0 10 VR, REVERSE VOLTAGE (VOLTS) 100 Figure 7. Typical Capacitance, Per Leg http://onsemi.com 4 BYV32-200 PACKAGE DIMENSIONS TO-220 THREE-LEAD TO-220AB CASE 221A-09 ISSUE AD SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. DIM A B C D F G H J K L N Q R S T U V Z INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.018 0.025 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 0.045 --- --- 0.080 ANODE CATHODE ANODE CATHODE MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.46 0.64 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 --- --- 2.04 -T- B 4 F T S C Q 123 A U K H Z L V G D N R J STYLE 6: PIN 1. 2. 3. 4. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 5 BYV32-200/D |
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